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What is Kombyne?

Kombyne™ is an innovative Software as a Service (SaaS) platform specifically engineered for high-performance computing (HPC) workflows, initially developed for clients in industries like defense, automotive, aerospace, and academic research. This advanced tool allows users to tap into a variety of workflow solutions tailored for HPC computational fluid dynamics (CFD) applications, featuring capabilities such as dynamic extract generation, rendering functions, and simulation steering. Moreover, it offers users interactive monitoring and control, ensuring that simulations run smoothly without interference and without dependence on VTK. By utilizing extract workflows, users can significantly minimize the burden of managing large files, enabling real-time visualization of data. The system's in-transit workflow employs a unique method for quickly acquiring data from the solver code, permitting visualization and analysis to proceed without disrupting the ongoing operations of the solver. This distinct method, known as an endpoint, provides direct outputs of extracts, cutting planes, or point samples beneficial for data science, along with rendering images. Additionally, the Endpoint connects seamlessly to popular visualization software, improving the integration and overall functionality of the tool within various workflows. With its array of versatile features and user-friendly design, Kombyne™ promises to transform the management and execution of HPC tasks across a wide range of sectors, making it an essential asset for professionals in the field.

What is Ansys Icepak?

Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.

Media

Media

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

API Availability

Has API

API Availability

Has API

Pricing Information

Pricing not provided.
Free Trial Offered?
Free Version

Pricing Information

Pricing not provided.
Free Trial Offered?
Free Version

Supported Platforms

SaaS
Android
iPhone
iPad
Windows
Mac
On-Prem
Chromebook
Linux

Supported Platforms

SaaS
Android
iPhone
iPad
Windows
Mac
On-Prem
Chromebook
Linux

Customer Service / Support

Standard Support
24 Hour Support
Web-Based Support

Customer Service / Support

Standard Support
24 Hour Support
Web-Based Support

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Company Facts

Organization Name

Kombyne

Company Location

United States

Company Website

kombyne.net

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/products/electronics/ansys-icepak

Categories and Features

CFD

HPC

Simulation

1D Simulation
3D Modeling
3D Simulation
Agent-Based Modeling
Continuous Modeling
Design Analysis
Direct Manipulation
Discrete Event Modeling
Dynamic Modeling
Graphical Modeling
Industry Specific Database
Monte Carlo Simulation
Motion Modeling
Presentation Tools
Stochastic Modeling
Turbulence Modeling

Categories and Features

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