List of Ansys Electronics Desktop (AEDT) Integrations
This is a list of platforms and tools that integrate with Ansys Electronics Desktop (AEDT). This list is updated as of April 2025.
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Ansys Motor-CAD
Ansys
Accelerate electric machine design with rapid multiphysics simulations.Ansys MotorCAD serves as a specialized tool tailored for the design of electric machines. It enables rapid simulations of multiphysics throughout the complete torque-speed operating spectrum. With MotorCAD, engineers can assess various motor topologies within this full range, leading to designs that are fine-tuned for size, efficiency, and overall performance. The software comprises four modules—Emag, Therm Lab, and Mech—facilitating swift and iterative multiphysics calculations, thereby allowing users to transition from initial concepts to final designs more expeditiously. Moreover, MotorCAD empowers users to investigate a wider array of motor topologies and thoroughly analyze the effects of advanced losses during the preliminary phases of electromechanical design, aided by its efficient data input system. The latest update introduces robust new features aimed at optimizing design, enhancing multi-physics analysis, and improving system modeling for electric motors. Additionally, the speed of multiphysics simulations across the entire torque-speed spectrum ensures that engineers can make informed decisions quickly. In summary, MotorCAD significantly accelerates the design process while providing comprehensive analytical capabilities. -
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Ansys Maxwell
Ansys
Unlock precision design and efficiency in electromechanical systems.Ansys Maxwell is an electromagnetic field solver specifically designed for use in electric machines, transformers, wireless charging solutions, permanent magnet latches, actuators, and a range of electromechanical devices. It proficiently analyzes static, frequency-domain, and time-varying electric and magnetic fields. The software is equipped with specialized design tools tailored for electric machines and power converters. With Maxwell, users are able to thoroughly evaluate the nonlinear and transient characteristics of electromechanical components and their effects on drive circuits and control system frameworks. By leveraging Maxwell’s advanced electromagnetic field solvers in conjunction with circuit and systems simulation technologies, users can acquire valuable insights into the behavior of electromechanical systems before they build a physical prototype. Furthermore, Maxwell is esteemed for its ability to provide dependable simulations of low-frequency electromagnetic fields prevalent in industrial settings, which is crucial for achieving superior design and functionality in practical applications. This powerful capability establishes Maxwell as an indispensable resource for engineers aiming to enhance their designs and elevate overall system efficiency. As such, it plays a pivotal role in the innovation and optimization of electromechanical engineering projects. -
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Ansys Icepak
Ansys
Optimize electronic cooling with powerful CFD thermal management.Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies. -
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Ansys HFSS
Ansys
Empowering engineers with precision in high-frequency design.Ansys HFSS is a highly adaptable 3D electromagnetic simulation software, tailored for the design and analysis of high-frequency electronic devices like antennas, components, interconnects, connectors, integrated circuits (ICs), and printed circuit boards (PCBs). This tool equips engineers with the capability to accurately model and simulate a diverse array of high-frequency electronic products, including antenna arrays, RF and microwave components, high-speed interconnects, filters, and IC packages. Employed worldwide, Ansys HFSS is vital for the development of high-speed electronics, which are essential for communication systems, advanced driver assistance systems (ADAS), satellite technologies, and internet-of-things (IoT) applications. Renowned for its unmatched capabilities and superior accuracy, HFSS empowers engineers to address RF, microwave, IC, PCB, and EMI challenges within even the most complex systems. The HFSS simulation suite boasts an extensive selection of solvers that address a wide range of electromagnetic problems, providing comprehensive support for engineers engaged in cutting-edge electronic design. Notably, Ansys HFSS not only enhances innovation but also significantly improves efficiency in the realm of high-frequency electronics, making it an indispensable tool for engineers in the industry. By streamlining the design process, it ultimately contributes to the advancement of technology in various high-tech fields.
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