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What is Ansys Icepak?

Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.

What is Ansys Cloud Direct?

Ansys Cloud Direct offers a robust and user-friendly HPC cloud solution that will transform your perspective on simulation. In contrast to other cloud-based simulation platforms, Ansys Cloud Direct is effortless to install and use, seamlessly integrates into your existing workflow, and eliminates the need for specialized cloud expertise. The focus of Ansys Cloud Direct is centered around enhancing Workflow, optimizing Performance, and providing exceptional Support. With its intuitive design, users can accelerate their simulation processes without the usual complexities associated with cloud solutions.

Media

Media

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Integrations Supported

MORAI
Microsoft Azure
Moldex3D
eQube®-DaaS

API Availability

API Availability

Pricing Information

Pricing not provided
Free Trial Offered?

Pricing Information

Please contact us for more information on our offers
Free Trial Offered?

Supported Platforms

Windows
Linux

Supported Platforms

SaaS

Customer Service / Support

Standard Support
Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub
Webinars
On-Site Training

Training Options

Documentation Hub
Webinars
Online Training

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/products/electronics/ansys-icepak

Company Facts

Organization Name

Ansys

Date Founded

1970

Company Location

United States

Company Website

upl.inc/Bf578F

Categories and Features

CFD

Not specified

IC Design

Not specified

Categories and Features

CAD

Not specified

Cloud Management

Not specified

Cloud PBX

Not specified

Cloud Security

Not specified

Cloud Storage

Not specified

DevOps

Not specified

Digital Asset Management

Reporting/Analytics

Digital Experience Platforms (DXP)

Reporting / Analytics
Workflow Management

Electrical Design

Drag & Drop

ELN

Not specified

Simulation

Not specified

Single Sign On

Not specified

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