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What is Ansys Icepak?

Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.

What is Ansys HPC?

The Ansys HPC software suite empowers users to leverage modern multicore processors, enabling a greater number of simulations to be conducted in reduced timeframes. With the advent of high-performance computing (HPC), these simulations can achieve unprecedented levels of size, complexity, and accuracy. Ansys offers flexible HPC licensing options that cater to various computational needs, ranging from single-user setups to small-group configurations, all the way to expansive parallel capabilities for larger teams. This flexibility allows for highly scalable parallel processing simulations, making it suitable for tackling even the most challenging projects. Additionally, Ansys provides both parallel computing solutions and parametric computing, facilitating the exploration of design parameters such as dimensions, weight, shape, and material properties. By integrating these tools early in the product development cycle, teams can enhance their design processes significantly while improving overall efficiency. This comprehensive approach positions Ansys as a leader in supporting innovative engineering workflows.

Media

Media

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

API Availability

Has API

API Availability

Has API

Pricing Information

Pricing not provided.
Free Trial Offered?
Free Version

Pricing Information

Pricing not provided.
Free Trial Offered?
Free Version

Supported Platforms

SaaS
Android
iPhone
iPad
Windows
Mac
On-Prem
Chromebook
Linux

Supported Platforms

SaaS
Android
iPhone
iPad
Windows
Mac
On-Prem
Chromebook
Linux

Customer Service / Support

Standard Support
24 Hour Support
Web-Based Support

Customer Service / Support

Standard Support
24 Hour Support
Web-Based Support

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/products/electronics/ansys-icepak

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/it-solutions/hpc

Categories and Features

Categories and Features

HPC

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