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Ratings and Reviews 0 Ratings
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What is Ansys Sherlock?
Ansys Sherlock distinguishes itself as the only electronics design platform that utilizes reliability physics, providing rapid and accurate predictions of the lifespan of electronic components, boards, and systems in the early design stages. This automated analysis tool streamlines the design workflow and effectively bypasses the conventional "test-fail-fix-repeat" cycle by enabling designers to thoroughly simulate the interactions among silicon, metal layers, semiconductor packages, printed circuit boards (PCBs), and assemblies, thereby pinpointing potential failure vulnerabilities caused by thermal, mechanical, and manufacturing stresses before prototype development. With a comprehensive library exceeding 500,000 components, Sherlock adeptly converts electronic computer-aided design (ECAD) files into intricate computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each model generated is designed with accurate geometries and material properties, providing a detailed and thorough representation of stress data. This groundbreaking methodology not only improves the design process but also significantly shortens the time it takes for electronic products to reach the market, ultimately giving companies a competitive edge. Furthermore, the ability to preemptively identify and address issues during the design phase enhances the overall reliability and performance of the final products.
What is Ansys Icepak?
Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.
Integrations Supported
API Availability
Has API
API Availability
Pricing Information
Pricing not provided
Free Trial Offered?
Pricing Information
Pricing not provided
Free Trial Offered?
Supported Platforms
SaaS
Supported Platforms
Windows
Linux
Customer Service / Support
Standard Support
Web-Based Support
Customer Service / Support
Standard Support
Web-Based Support
Training Options
Documentation Hub
Webinars
Online Training
Training Options
Documentation Hub
Webinars
On-Site Training
Company Facts
Organization Name
Ansys
Date Founded
1970
Company Location
United States
Company Website
www.ansys.com/products/structures/ansys-sherlock
Company Facts
Organization Name
Ansys
Company Location
United States
Company Website
www.ansys.com/products/electronics/ansys-icepak
Categories and Features
CFD
Not specified
Computer-Aided Engineering (CAE)
Not specified
Finite Element Analysis (FEA)
Not specified
Thermal Analysis
Not specified