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What is COLDFORM?

Cold forming tools endure substantial mechanical and tribological pressures during their use, which can occasionally lead to early failures. Since these tools represent a significant portion of component manufacturing expenses, it becomes essential to proactively identify and mitigate potential problems during the design stage. The COLDFORM® software provides a means to evaluate the mechanical integrity of dies, significantly contributing to their durability. It analyzes stress distribution within the die while also tracking deformations, wear, temperature fluctuations, and any potential damage that may arise during operations. Moreover, COLDFORM® facilitates rapid assessments by applying stresses obtained from the forming process directly to the tools. The software also enables coupled part/tool simulations, which results in highly precise predictions. With a focus on pre-stressed dies, it allows for an accurate evaluation of the necessary pre-stressing for the tools' interference fit. This functionality is invaluable for manufacturers aiming to enhance tool efficacy while simultaneously minimizing expenses related to tool replacements. By leveraging these capabilities, companies can ensure that their cold forming processes are both efficient and cost-effective.

What is Ansys Sherlock?

Ansys Sherlock distinguishes itself as the only electronics design platform that utilizes reliability physics, providing rapid and accurate predictions of the lifespan of electronic components, boards, and systems in the early design stages. This automated analysis tool streamlines the design workflow and effectively bypasses the conventional "test-fail-fix-repeat" cycle by enabling designers to thoroughly simulate the interactions among silicon, metal layers, semiconductor packages, printed circuit boards (PCBs), and assemblies, thereby pinpointing potential failure vulnerabilities caused by thermal, mechanical, and manufacturing stresses before prototype development. With a comprehensive library exceeding 500,000 components, Sherlock adeptly converts electronic computer-aided design (ECAD) files into intricate computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each model generated is designed with accurate geometries and material properties, providing a detailed and thorough representation of stress data. This groundbreaking methodology not only improves the design process but also significantly shortens the time it takes for electronic products to reach the market, ultimately giving companies a competitive edge. Furthermore, the ability to preemptively identify and address issues during the design phase enhances the overall reliability and performance of the final products.

Media

Media

Integrations Supported

Additional information not provided

Integrations Supported

Additional information not provided

API Availability

API Availability

Has API

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

Windows

Supported Platforms

SaaS

Customer Service / Support

Standard Support
Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub
Webinars
Online Training

Training Options

Documentation Hub
Webinars
Online Training

Company Facts

Organization Name

TRANSVALOR

Date Founded

1984

Company Location

France

Company Website

www.transvalor.com/en/coldform

Company Facts

Organization Name

Ansys

Date Founded

1970

Company Location

United States

Company Website

www.ansys.com/products/structures/ansys-sherlock

Categories and Features

Simulation

Not specified

Categories and Features

CFD

Not specified

Thermal Analysis

Not specified

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