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What is CONSELF?

With the use of CONSELF, you can tap into the capabilities of Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) to improve your product designs by minimizing drag and fluid-related losses, enhancing efficiency, optimizing heat exchange processes, evaluating pressure loads, verifying material strength, studying deformation in component shapes, and calculating natural frequencies and modes, among other vital functions. The platform supports both static and dynamic simulations in Structural Mechanics, effectively addressing the behavior of materials under both elastic and plastic conditions. Furthermore, it facilitates modal and frequency analyses, beginning with commonly utilized CAD neutral file formats, which guarantees a smooth integration into your design workflow. This holistic approach not only leads to innovative solutions for intricate engineering problems but also empowers engineers to make informed decisions with confidence in their designs. As a result, the use of CONSELF can significantly streamline the development process and improve overall product performance.

What is Ansys Icepak?

Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.

Media

Media

Integrations Supported

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

SaaS

Supported Platforms

Windows
Linux

Customer Service / Support

Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Not specified

Training Options

Documentation Hub
Webinars
On-Site Training

Company Facts

Organization Name

CONSELF

Date Founded

2017

Company Location

Italy

Company Website

conself.com

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/products/electronics/ansys-icepak

Categories and Features

CFD

Not specified

Simulation

3D Modeling
3D Simulation
Agent-Based Modeling
Design Analysis
Industry Specific Database
Presentation Tools
Turbulence Modeling

Categories and Features

CFD

Not specified

IC Design

Not specified

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