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What is LoopCAD?

LoopCAD has established itself as the premier software for producing high-quality circuit layouts tailored for radiant heating systems. The newest iteration, LoopCAD 2021, delivers an array of advanced design features, including built-in calculations for both heating and cooling loads, extensive hydronic evaluations, snowmelt design options, and 3D CAD visualizations, while also accommodating various OEM design techniques and materials. Notably, the MJ8 Edition integrates ACCA®-Approved Manual J® (8th Edition) calculations specifically designed for residential heating and cooling needs. Celebrated for its intuitive interface and robust capabilities, LoopCAD is frequently regarded as the most efficient tool for radiant heating design. Users can rapidly produce floorplan layouts with a collection of predefined elements such as rooms, doors, and windows, and adjusting dimensions is as straightforward as dragging walls or corners. The software also enables the seamless joining of rooms to create intricate floor plans. Additionally, the capacity to easily alter room shapes allows for the design of complex layouts, while the inclusion of freehand drawing tools provides even more creative freedom in producing unique designs. This combination of efficiency and sophisticated functionality positions LoopCAD as an indispensable asset for designers in the radiant heating sector. Ultimately, its versatility and ease of use make it an essential tool for both novice and experienced professionals alike.

What is Ansys Icepak?

Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.

Media

Media

Integrations Supported

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

API Availability

API Availability

Pricing Information

$595 one-time payment
Free Trial Offered?

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

SaaS

Supported Platforms

Windows
Linux

Customer Service / Support

Standard Support
Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub

Training Options

Documentation Hub
Webinars
On-Site Training

Company Facts

Organization Name

Avenir Software

Company Website

www.avenir-online.com

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/products/electronics/ansys-icepak

Categories and Features

CAD

2D Drawing
3D Modeling
Civil
Collaboration
Design Analysis
Design Export
Document Management
Electrical
Mechanical
Mechatronics
Presentation Tools

Categories and Features

CFD

Not specified

IC Design

Not specified

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