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What is Quick School?

The Fangkuai Headquarters Base is equipped with a specialized research and development center, a fully functional laboratory, and two manufacturing areas that together span 120,000 square meters. Recognized as a leading domestic authority in boiler automation, this company distributes its products to various countries and regions globally. Their innovative boiler designs incorporate a condensing device that effectively captures and reuses heat from flue gases, thereby greatly improving overall performance. To reduce heat loss, ultra-fine glass wool insulation is carefully installed between the smoke box and the tube sheet, significantly minimizing unwanted heat escape. Additionally, the flue gas experiences heat exchange through a spiral finned tube system located in both the condenser and economizer, which enhances heat transfer efficiency, achieves a minimum 4% decrease in fuel consumption, and boosts thermal efficiency to an impressive 104%. This relentless focus on efficiency and innovation firmly establishes Fangkuai as a frontrunner in the industry, continually setting benchmarks for others to follow. Their ongoing advancements not only benefit their operations but also contribute to a more sustainable future.

What is Ansys Icepak?

Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.

Media

Media

Integrations Supported

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

SaaS

Supported Platforms

Windows
Linux

Customer Service / Support

24 Hour Support
Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

On-Site Training

Training Options

Documentation Hub
Webinars
On-Site Training

Company Facts

Organization Name

Vertix Computing

Date Founded

2015

Company Location

India

Company Website

quickschool.in

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/products/electronics/ansys-icepak

Categories and Features

School Management

Bookstore Management
Curriculum Management
Facility Management
Financial Management
K-12
Library Management
Online Calendar
Online Payments
Parent / Student Portal
Reporting/Analytics

School Portal

Not specified

Categories and Features

CFD

Not specified

IC Design

Not specified

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