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What is Stallion 3D?

Stallion 3D swiftly generates crucial aerodynamic performance metrics such as lift, drag, and moments for both newly created and pre-existing CAD models. The software excels in delivering high-quality RANS results without requiring any manual grid setup, as its grid generation process is completely automated. This capability significantly alleviates one of the most labor-intensive aspects of computational fluid dynamics (CFD). Employing a distinctive CFD algorithm called HIST, Stallion 3D precisely predicts the aerodynamic properties of your designs. With the ability to effortlessly import CAD models, it creates essential 3D aerodynamic data that aids in validating your designs and fostering success. The software provides comprehensive reports detailing lift and drag forces, along with yaw, roll, and pitch moments oriented along specified coordinate axes. Furthermore, it features 2D line graphs that depict Cp, velocity, Mach number, density, and temperature at fixed coordinate points across the STL surface, enabling users to visualize parameters like Cp (x) at different span locations along the wing. This innovative approach not only enhances the efficiency of the aerodynamic analysis process but also empowers designers to achieve superior performance outcomes. In essence, Stallion 3D transforms the way aerodynamic analysis is conducted, making it a crucial tool for modern design teams.

What is Ansys Icepak?

Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.

Media

Media

Integrations Supported

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

Windows

Supported Platforms

Windows
Linux

Customer Service / Support

Standard Support
Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub

Training Options

Documentation Hub
Webinars
On-Site Training

Company Facts

Organization Name

Hanley Innovations

Company Location

United States of America (USA)

Company Website

www.hanleyinnovations.com

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/products/electronics/ansys-icepak

Categories and Features

CAD

2D Drawing
3D Modeling
Civil
Collaboration
Design Analysis
Design Export
Document Management
Electrical
Mechanical
Mechatronics
Presentation Tools
Simulate Cycles
User Defined Cycles

CFD

Not specified

Categories and Features

CFD

Not specified

IC Design

Not specified

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