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What is Ansys RedHawk-SC?

Ansys RedHawk-SC is recognized as the gold standard for voltage drop and electromigration multiphysics verification in digital design endeavors. Its cutting-edge analytics quickly identify weaknesses and allow for exploratory scenarios that improve power efficiency alongside overall performance. Featuring a cloud-based architecture, RedHawk-SC can perform full-chip evaluations with exceptional speed and capacity. The tool's signoff precision is backed by prominent foundries for each finFET node, reaching down to 3nm technology. By utilizing advanced power analytics, Ansys RedHawk-SC enables the development of robust, low-power digital designs without sacrificing performance, providing designers with comprehensive methodologies to detect and address dynamic voltage drops. Additionally, the dependability of RedHawk-SC's multiphysics signoff analysis significantly reduces the risks associated with projects and technologies, rendering it an indispensable resource for engineers. Moreover, the accuracy of RedHawk's algorithms has been confirmed by leading foundries across all finFET processes, showcasing their success in numerous tapeouts. This all-encompassing strategy not only reinforces RedHawk-SC's standing as a vital tool in the face of contemporary digital design challenges but also ensures that engineers can deliver optimal results efficiently.

What is 3DIC Compiler?

The Synopsys 3DIC Compiler, rooted in the premier digital implementation platform available in the market and utilizing a cohesive fusion data model, streamlines the transition to 2.5/3D heterogeneous integration. This all-encompassing ecosystem aids in conducting analysis-driven feasibility studies, enabling multi-die partitioning, and selecting suitable foundry technologies for both prototyping and floor planning purposes. Consequently, it empowers design implementation that is guided by meticulous analysis, encompassing sophisticated packaging and routing among dies, as well as thorough verification processes. Additionally, the 3DIC Compiler integrates with Synopsys 3DSO.ai, the pioneering autonomous AI optimization tool tailored for multi-die configurations, thereby optimizing performance and quality across critical domains such as thermal integrity, signal integrity, and power network design. The successful implementation of the 3DIC Compiler by a multitude of clients, coupled with certifications from leading foundries for its compatibility with cutting-edge process and packaging technologies, underscores its dependability and effectiveness across various applications. Ultimately, this emphasizes the platform's pivotal contribution to advancing semiconductor design methodologies and its role in shaping the future of the industry.

Media

Media

Integrations Supported

AWS Marketplace

Integrations Supported

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

SaaS

Supported Platforms

Windows

Customer Service / Support

Standard Support
24 Hour Support
Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub
Webinars
Online Training

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Company Facts

Organization Name

Ansys

Date Founded

1970

Company Location

United States

Company Website

www.ansys.com/products/semiconductors/ansys-redhawk-sc

Company Facts

Organization Name

Synopsys

Date Founded

1986

Company Location

United States

Company Website

www.synopsys.com/implementation-and-signoff/3dic-design.html

Categories and Features

Electrical Design

Not specified

PCB Design

Not specified

Categories and Features

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