What is 3DIC Compiler?
The Synopsys 3DIC Compiler, rooted in the premier digital implementation platform available in the market and utilizing a cohesive fusion data model, streamlines the transition to 2.5/3D heterogeneous integration. This all-encompassing ecosystem aids in conducting analysis-driven feasibility studies, enabling multi-die partitioning, and selecting suitable foundry technologies for both prototyping and floor planning purposes. Consequently, it empowers design implementation that is guided by meticulous analysis, encompassing sophisticated packaging and routing among dies, as well as thorough verification processes. Additionally, the 3DIC Compiler integrates with Synopsys 3DSO.ai, the pioneering autonomous AI optimization tool tailored for multi-die configurations, thereby optimizing performance and quality across critical domains such as thermal integrity, signal integrity, and power network design. The successful implementation of the 3DIC Compiler by a multitude of clients, coupled with certifications from leading foundries for its compatibility with cutting-edge process and packaging technologies, underscores its dependability and effectiveness across various applications. Ultimately, this emphasizes the platform's pivotal contribution to advancing semiconductor design methodologies and its role in shaping the future of the industry.
Pricing
Free Trial Offered?:
Yes
Integrations
No integrations listed.
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Company Facts
Company Name:
Synopsys
Date Founded:
1986
Company Location:
United States
Company Website:
www.synopsys.com/implementation-and-signoff/3dic-design.html
Product Details
Deployment
Windows
Training Options
Documentation Hub
Online Training
Webinars
On-Site Training
Video Library
Support
Standard Support
Web-Based Support
Product Details
Target Company Sizes
Individual
1-10
11-50
51-200
201-500
501-1000
1001-5000
5001-10000
10001+
Target Organization Types
Mid Size Business
Small Business
Enterprise
Freelance
Nonprofit
Government
Startup
Supported Languages
English