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What is PrimeSim HSPICE?

PrimeSim HSPICE circuit simulation stands as the benchmark within the industry for accurate circuit analysis. It boasts foundry-certified MOS models along with advanced simulation and analytical algorithms. With a legacy spanning over 25 years, HSPICE has proven its reliability in design tape outs and is regarded as the foremost circuit simulator in the field. It is utilized for on-chip simulations across various domains, including analog designs, RF, custom digital, standard cell design, as well as memory design and characterization. Additionally, it is employed for off-chip signal integrity simulations, covering the full spectrum from silicon to package to board and backplane analysis. Serving as a vital part of Synopsys's analog/mixed-signal (AMS) verification suite, HSPICE effectively tackles the major challenges associated with AMS verification. Its reputation for precision in circuit simulation remains unmatched, further enhanced by its provision of cutting-edge simulation techniques and foundry-validated MOS device models. With its comprehensive capabilities, it continues to be an essential tool for engineers in the semiconductor industry.

What is 3DIC Compiler?

The Synopsys 3DIC Compiler, rooted in the premier digital implementation platform available in the market and utilizing a cohesive fusion data model, streamlines the transition to 2.5/3D heterogeneous integration. This all-encompassing ecosystem aids in conducting analysis-driven feasibility studies, enabling multi-die partitioning, and selecting suitable foundry technologies for both prototyping and floor planning purposes. Consequently, it empowers design implementation that is guided by meticulous analysis, encompassing sophisticated packaging and routing among dies, as well as thorough verification processes. Additionally, the 3DIC Compiler integrates with Synopsys 3DSO.ai, the pioneering autonomous AI optimization tool tailored for multi-die configurations, thereby optimizing performance and quality across critical domains such as thermal integrity, signal integrity, and power network design. The successful implementation of the 3DIC Compiler by a multitude of clients, coupled with certifications from leading foundries for its compatibility with cutting-edge process and packaging technologies, underscores its dependability and effectiveness across various applications. Ultimately, this emphasizes the platform's pivotal contribution to advancing semiconductor design methodologies and its role in shaping the future of the industry.

Media

Media

Integrations Supported

OptSim
PrimeWave Design Environment

Integrations Supported

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

Windows
Linux

Supported Platforms

Windows

Customer Service / Support

Standard Support
Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Company Facts

Organization Name

Synopsys

Date Founded

1986

Company Location

United States

Company Website

www.synopsys.com/implementation-and-signoff/ams-simulation/primesim-hspice.html

Company Facts

Organization Name

Synopsys

Date Founded

1986

Company Location

United States

Company Website

www.synopsys.com/implementation-and-signoff/3dic-design.html

Categories and Features

Circuit Simulation

Not specified

Simulation

Not specified

Categories and Features

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