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What is Celsius PowerDC?

Cadence Celsius PowerDC technology provides effective DC analysis that guarantees dependable power distribution. This system incorporates electrical and thermal simulations to enhance precision. By swiftly pinpointing regions experiencing significant IR drops and thermal hotspots, it effectively reduces the likelihood of design failures. The technology maintains high accuracy, even in intricate designs featuring various voltage domains and complex plane structures, delivering definitive IR analysis for both boards and packages. Additionally, DC simulations can be conveniently initiated through PowerTree Technology, utilizing source and sink definitions established during the schematic design phase. Furthermore, it accommodates diverse structures, such as stacked boards, multiple chips, and all widely used packaging types, making it a versatile choice for engineers.

What is Ansys Icepak?

Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.

Media

Media

Integrations Supported

AutoCAD
CryptoTax360°
Sigrity X Platform

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

SaaS

Supported Platforms

Windows
Linux

Customer Service / Support

24 Hour Support
Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub
Online Training

Training Options

Documentation Hub
Webinars
On-Site Training

Company Facts

Organization Name

Cadence Design Systems

Date Founded

1988

Company Location

United States

Company Website

www.cadence.com

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/products/electronics/ansys-icepak

Categories and Features

PCB Design

Not specified

Categories and Features

CFD

Not specified

IC Design

Not specified

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