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What is Kocliko?

In the field of social housing and co-ownership, residents benefit from a well-regulated system that ensures fair distribution of heating costs. Enhanced management of heating systems leads to financial advantages for all while promoting environmental sustainability. The innovative dynamic thermal twin technology effectively caters to the differing heating requirements of each unit based on its specific location within the structure. Kocliko effectively eliminates concerns about heat theft, enabling tenants and co-owners to understand and forecast their energy expenses in line with their comfort levels. This clarity is crucial for the successful customization of heating charges. Moreover, the Kocliko solution effortlessly integrates with existing management frameworks, simplifying the billing process and ensuring accuracy. This strategy not only improves fairness in the allocation of heating expenses but also offers a comprehensive insight into the communal challenges related to heating. Consequently, embracing such forward-thinking solutions cultivates an atmosphere of cooperation and mutual support among residents, allowing everyone to flourish in their living environment. As a result, the overall quality of life within the community is significantly enhanced.

What is Ansys Icepak?

Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.

Media

Media

Integrations Supported

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

SaaS

Supported Platforms

Windows
Linux

Customer Service / Support

Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Online Training

Training Options

Documentation Hub
Webinars
On-Site Training

Company Facts

Organization Name

Kocliko

Date Founded

2016

Company Location

France

Company Website

www.kocliko.co

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/products/electronics/ansys-icepak

Categories and Features

Energy Management

Not specified

Categories and Features

CFD

Not specified

IC Design

Not specified

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