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What is Siemens Solido?

Thousands of designers at top semiconductor companies worldwide rely on Solido's variation-aware design solutions, which encompass IP validation, library characterization, and advanced simulation technologies powered by state-of-the-art AI. This comprehensive suite includes AI-optimized SPICE, Fast SPICE, and mixed-signal simulators that enable clients to accelerate essential design and verification tasks for sophisticated analog, mixed-signal, and custom IC designs significantly. It provides the fastest and most comprehensive integrated IP validation solution in the industry, guaranteeing thorough IP quality assurance from the initial design stage through to tape-out, while addressing all design aspects and incorporating IP updates efficiently. Additionally, this all-encompassing AI-driven design environment supports both nominal and variation-aware verification for custom IC circuits, ensuring complete design coverage with a dramatically reduced number of simulations, all while achieving accuracy on par with traditional brute-force techniques. In addition, it presents swift and accurate library characterization tools that utilize machine learning to boost performance and reliability. By streamlining these processes, designers can focus more on innovation and less on time-consuming verification tasks.

What is Ansys Icepak?

Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.

Media

Media

Integrations Supported

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

Windows
Linux

Supported Platforms

Windows
Linux

Customer Service / Support

Standard Support
Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub
Webinars
On-Site Training

Training Options

Documentation Hub
Webinars
On-Site Training

Company Facts

Organization Name

Siemens

Date Founded

1847

Company Location

United States

Company Website

eda.sw.siemens.com/en-US/ic/solido/

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/products/electronics/ansys-icepak

Categories and Features

IC Design

Not specified

Categories and Features

CFD

Not specified

IC Design

Not specified

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