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What is Synthelyzer™ ECAD Plugin?

Effortlessly conduct electrical stress evaluations, MTBF computations, component derating, and FMECA assessments within your ECAD during the board design process. Key Features: • Leverages state-of-the-art AI technologies for efficient and resilient design. * Seamlessly integrates with top ECAD software for enhanced workflows and real-time evaluations. * Incorporates automated circuit strain calculators to accelerate the design timeline. • Executes in-depth analyses on electrical stress derivation for various components. * Enhances derating accuracy by utilizing outcomes from thermal simulations. * Supplies thermal resistance and stress metrics for 3D thermal simulations. * Detects EOS violations through Pareto analysis, along with comprehensive reports on overstress and overdesign issues. * Suggests design modifications to effectively address overstress challenges. * Applies derating guidelines to ensure optimal performance of components. * Automates FMECA analysis, making it more efficient and less prone to error. * This comprehensive toolset empowers engineers to achieve superior design reliability and performance.

What is Ansys Icepak?

Ansys Icepak is a specialized computational fluid dynamics (CFD) tool tailored for the thermal management of electronic systems. It accurately predicts airflow, temperature gradients, and heat transfer in integrated circuit (IC) packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the powerful Ansys Fluent CFD solver, Icepak delivers comprehensive solutions for electronic cooling, enabling detailed assessments of thermal and fluid dynamics within diverse electronic components. The software is seamlessly integrated with the Ansys Electronics Desktop (AEDT), which provides an intuitive graphical interface that enhances user experience and accessibility. Users can perform extensive analyses of conduction, convection, and radiation, taking advantage of advanced modeling capabilities for both laminar and turbulent flows, alongside species transport involving radiation and convection phenomena. Additionally, Ansys offers a complete PCB design solution that facilitates the simulation of PCBs, ICs, and packages, leading to accurate evaluations of entire electronic systems. This integration empowers engineers to refine their thermal management approaches, ensuring that electronic devices operate reliably and efficiently while meeting performance requirements in various applications. Ultimately, the robust features of Ansys Icepak make it an essential tool for engineers focused on optimizing the thermal performance of electronic technologies.

Media

No images available

Media

Integrations Supported

BQR
apmOptimizer

Integrations Supported

Ansys Electronics Desktop (AEDT)
Ansys Fluent

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

Windows

Supported Platforms

Windows
Linux

Customer Service / Support

Not specified

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Training Options

Documentation Hub
Webinars
On-Site Training

Company Facts

Organization Name

BQR Reliability Engineering

Date Founded

1989

Company Website

www.bqr.com

Company Facts

Organization Name

Ansys

Company Location

United States

Company Website

www.ansys.com/products/electronics/ansys-icepak

Categories and Features

Categories and Features

CFD

Not specified

IC Design

Not specified

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