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What is Synthelyzer™ ECAD Plugin?

Effortlessly conduct electrical stress evaluations, MTBF computations, component derating, and FMECA assessments within your ECAD during the board design process. Key Features: • Leverages state-of-the-art AI technologies for efficient and resilient design. * Seamlessly integrates with top ECAD software for enhanced workflows and real-time evaluations. * Incorporates automated circuit strain calculators to accelerate the design timeline. • Executes in-depth analyses on electrical stress derivation for various components. * Enhances derating accuracy by utilizing outcomes from thermal simulations. * Supplies thermal resistance and stress metrics for 3D thermal simulations. * Detects EOS violations through Pareto analysis, along with comprehensive reports on overstress and overdesign issues. * Suggests design modifications to effectively address overstress challenges. * Applies derating guidelines to ensure optimal performance of components. * Automates FMECA analysis, making it more efficient and less prone to error. * This comprehensive toolset empowers engineers to achieve superior design reliability and performance.

What is Ansys Sherlock?

Ansys Sherlock distinguishes itself as the only electronics design platform that utilizes reliability physics, providing rapid and accurate predictions of the lifespan of electronic components, boards, and systems in the early design stages. This automated analysis tool streamlines the design workflow and effectively bypasses the conventional "test-fail-fix-repeat" cycle by enabling designers to thoroughly simulate the interactions among silicon, metal layers, semiconductor packages, printed circuit boards (PCBs), and assemblies, thereby pinpointing potential failure vulnerabilities caused by thermal, mechanical, and manufacturing stresses before prototype development. With a comprehensive library exceeding 500,000 components, Sherlock adeptly converts electronic computer-aided design (ECAD) files into intricate computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each model generated is designed with accurate geometries and material properties, providing a detailed and thorough representation of stress data. This groundbreaking methodology not only improves the design process but also significantly shortens the time it takes for electronic products to reach the market, ultimately giving companies a competitive edge. Furthermore, the ability to preemptively identify and address issues during the design phase enhances the overall reliability and performance of the final products.

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Media

Integrations Supported

BQR
apmOptimizer

Integrations Supported

API Availability

API Availability

Has API

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

Windows

Supported Platforms

SaaS

Customer Service / Support

Not specified

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Training Options

Documentation Hub
Webinars
Online Training

Company Facts

Organization Name

BQR Reliability Engineering

Date Founded

1989

Company Website

www.bqr.com

Company Facts

Organization Name

Ansys

Date Founded

1970

Company Location

United States

Company Website

www.ansys.com/products/structures/ansys-sherlock

Categories and Features

Categories and Features

CFD

Not specified

Thermal Analysis

Not specified

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