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What is HyperLynx?

HyperLynx provides a comprehensive set of tools for signal integrity, power integrity, 3D electromagnetic modeling, and electrical rule checking specifically designed for high-speed digital applications. By combining intuitive features with automated workflows, HyperLynx makes it easier for mainstream system designers to conduct high-speed design analyses, allowing for the early detection and correction of potential issues throughout the design process. Its seamless compatibility with various PCB tools enhances its value within any PCB design environment. The HyperLynx suite guarantees a thorough analysis framework, integrating best-practice design rule checking with detailed simulations focused on both signal and power integrity. Utilizing cutting-edge 3D electromagnetic solvers, it generates accurate interconnect models that significantly improve the design workflow. Users can evaluate design trade-offs prior to layout and thoroughly validate their designs before manufacturing through extensive post-layout analyses. This versatile tool serves multiple applications, such as SerDes channels, DDRx memory interfaces, and general signal integrity evaluations. Furthermore, it streamlines the design and validation of power-delivery networks (PDN), ensuring compliance with impedance requirements in an accessible format. With its powerful capabilities, HyperLynx equips engineers to confidently develop high-performance designs while minimizing risks associated with potential design flaws. By fostering a more efficient design process, it ultimately enhances the overall quality and reliability of high-speed digital systems.

What is 3DIC Compiler?

The Synopsys 3DIC Compiler, rooted in the premier digital implementation platform available in the market and utilizing a cohesive fusion data model, streamlines the transition to 2.5/3D heterogeneous integration. This all-encompassing ecosystem aids in conducting analysis-driven feasibility studies, enabling multi-die partitioning, and selecting suitable foundry technologies for both prototyping and floor planning purposes. Consequently, it empowers design implementation that is guided by meticulous analysis, encompassing sophisticated packaging and routing among dies, as well as thorough verification processes. Additionally, the 3DIC Compiler integrates with Synopsys 3DSO.ai, the pioneering autonomous AI optimization tool tailored for multi-die configurations, thereby optimizing performance and quality across critical domains such as thermal integrity, signal integrity, and power network design. The successful implementation of the 3DIC Compiler by a multitude of clients, coupled with certifications from leading foundries for its compatibility with cutting-edge process and packaging technologies, underscores its dependability and effectiveness across various applications. Ultimately, this emphasizes the platform's pivotal contribution to advancing semiconductor design methodologies and its role in shaping the future of the industry.

Media

Media

Integrations Supported

Additional information not provided

Integrations Supported

Additional information not provided

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

SaaS

Supported Platforms

Windows

Customer Service / Support

Standard Support
Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub
Webinars
On-Site Training

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Company Facts

Organization Name

Siemens

Date Founded

1847

Company Location

Germany

Company Website

eda.sw.siemens.com/en-US/pcb/hyperlynx/

Company Facts

Organization Name

Synopsys

Date Founded

1986

Company Location

United States

Company Website

www.synopsys.com/implementation-and-signoff/3dic-design.html

Categories and Features

PCB Design

Not specified

Categories and Features

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