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What is Multisim?

Multisimâ„¢ software merges the well-established SPICE simulation with an intuitive schematic environment that facilitates the instant visualization and assessment of electronic circuit functionality. Its design prioritizes user engagement, aiming to support educators in solidifying circuit theory and improving student comprehension of concepts during their engineering education. By incorporating powerful circuit simulation and analysis into the design process, Multisimâ„¢ aids researchers and designers in significantly decreasing the number of printed circuit board (PCB) prototypes required, which in turn cuts development expenses considerably. Specifically designed for educational settings, Multisimâ„¢ functions as a valuable resource for courses and laboratories focused on analog, digital, and power electronics. With its extensive array of SPICE simulation capabilities, analysis tools, and PCB design features, Multisimâ„¢ enables engineers to refine their designs with greater efficiency and improve the performance of their prototypes. This software not only optimizes the design workflow but also promotes an interactive learning environment for students passionate about electronics, ultimately leading to a more thorough grasp of electronic concepts. By fostering such an engaging atmosphere, Multisimâ„¢ contributes significantly to the educational journey of future engineers.

What is Celsius PowerDC?

Cadence Celsius PowerDC technology provides effective DC analysis that guarantees dependable power distribution. This system incorporates electrical and thermal simulations to enhance precision. By swiftly pinpointing regions experiencing significant IR drops and thermal hotspots, it effectively reduces the likelihood of design failures. The technology maintains high accuracy, even in intricate designs featuring various voltage domains and complex plane structures, delivering definitive IR analysis for both boards and packages. Additionally, DC simulations can be conveniently initiated through PowerTree Technology, utilizing source and sink definitions established during the schematic design phase. Furthermore, it accommodates diverse structures, such as stacked boards, multiple chips, and all widely used packaging types, making it a versatile choice for engineers.

Media

Media

Integrations Supported

AutoCAD
CryptoTax360°
Sigrity X Platform

Integrations Supported

AutoCAD
CryptoTax360°
Sigrity X Platform

API Availability

Has API

API Availability

Has API

Pricing Information

Pricing not provided.
Free Trial Offered?
Free Version

Pricing Information

Pricing not provided.
Free Trial Offered?
Free Version

Supported Platforms

SaaS
Android
iPhone
iPad
Windows
Mac
On-Prem
Chromebook
Linux

Supported Platforms

SaaS
Android
iPhone
iPad
Windows
Mac
On-Prem
Chromebook
Linux

Customer Service / Support

Standard Support
24 Hour Support
Web-Based Support

Customer Service / Support

Standard Support
24 Hour Support
Web-Based Support

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Company Facts

Organization Name

NI

Date Founded

1976

Company Location

United States

Company Website

www.ni.com/en-us/shop/electronic-test-instrumentation/application-software-for-electronic-test-and-instrumentation-category/what-is-multisim.html

Company Facts

Organization Name

Cadence Design Systems

Date Founded

1988

Company Location

United States

Company Website

www.cadence.com

Categories and Features

PCB Design

3D Visualization
Autorouting
Collaboration Tools
Component Library
Design Rule Check
Differential Pair Routing
Schematic Editor

Categories and Features

PCB Design

3D Visualization
Autorouting
Collaboration Tools
Component Library
Design Rule Check
Differential Pair Routing
Schematic Editor

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