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What is Sigrity X Platform?

Step into the future with the Sigrity X Platform, where groundbreaking innovation meets optimal performance. Experience unmatched signal and power integrity for your PCB and IC package designs, allowing you to transcend the current limitations of signal integrity (SI) and power integrity (PI) technology. Imagine expertly maneuvering through the complex landscape of electronic design, not only meeting your objectives but also surpassing them with extraordinary efficiency and precision. With Sigrity X, you are utilizing a revolutionary tool that enables seamless incorporation of in-design analysis within the Allegro X PCB and IC Package platforms. Dive into a comprehensive suite of SI/PI analysis, in-design interconnect modeling, and PDN analysis tools meticulously crafted to enhance your performance, ensuring your projects consistently exceed expectations and remain on schedule and within budget. Harness the potential of the Sigrity X Platform to assure outstanding performance and dependability in your upcoming designs, establishing a new benchmark for success. This is your chance to transform the landscape of electronic design and spearhead innovation in your field, paving the way for future advancements. By embracing these capabilities, you are not just improving your current projects; you are setting yourself up for sustained excellence in the years to come.

What is 3DIC Compiler?

The Synopsys 3DIC Compiler, rooted in the premier digital implementation platform available in the market and utilizing a cohesive fusion data model, streamlines the transition to 2.5/3D heterogeneous integration. This all-encompassing ecosystem aids in conducting analysis-driven feasibility studies, enabling multi-die partitioning, and selecting suitable foundry technologies for both prototyping and floor planning purposes. Consequently, it empowers design implementation that is guided by meticulous analysis, encompassing sophisticated packaging and routing among dies, as well as thorough verification processes. Additionally, the 3DIC Compiler integrates with Synopsys 3DSO.ai, the pioneering autonomous AI optimization tool tailored for multi-die configurations, thereby optimizing performance and quality across critical domains such as thermal integrity, signal integrity, and power network design. The successful implementation of the 3DIC Compiler by a multitude of clients, coupled with certifications from leading foundries for its compatibility with cutting-edge process and packaging technologies, underscores its dependability and effectiveness across various applications. Ultimately, this emphasizes the platform's pivotal contribution to advancing semiconductor design methodologies and its role in shaping the future of the industry.

Media

Media

Integrations Supported

Celsius PowerDC
Sigrity X Advanced SI
Sigrity X Aurora
Sigrity X OptimizePI
Sigrity X PowerSI

Integrations Supported

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

SaaS
Windows

Supported Platforms

Windows

Customer Service / Support

Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Company Facts

Organization Name

Cadence Design Systems

Date Founded

1988

Company Location

United States

Company Website

www.cadence.com

Company Facts

Organization Name

Synopsys

Date Founded

1986

Company Location

United States

Company Website

www.synopsys.com/implementation-and-signoff/3dic-design.html

Categories and Features

Engineering

Not specified

IC Design

Not specified

PCB Design

Not specified

Categories and Features

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