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What is TAITherm?

Discover the comprehensive range of heat transfer mechanisms, which include convection, radiation, storage, and dissipation, while considering both steady-state and transient environmental scenarios. The TAITherm thermal analysis software merges ease of use with powerful features, adeptly managing solar and thermal radiation, convection, and conduction across various dynamic contexts. By simplifying the complexities inherent in thermal simulations, TAITherm ensures your designs achieve optimal performance in real-world applications. Engineers and teams globally trust TAITherm for a wide range of purposes, from pioneering innovations in automotive and electronics to advancements in wearables, military technology, and architecture. Our clients lead the charge in innovation, harnessing thermal simulations and analysis to improve usability, enhance safety, and boost efficiency within their industries, thereby pushing the boundaries of what technology can achieve. With TAITherm, the future of thermal analysis not only becomes attainable but also revolutionizes industries that aspire to reach new heights of excellence and success. This software empowers teams to create groundbreaking solutions that are both practical and forward-thinking.

What is Ansys Sherlock?

Ansys Sherlock distinguishes itself as the only electronics design platform that utilizes reliability physics, providing rapid and accurate predictions of the lifespan of electronic components, boards, and systems in the early design stages. This automated analysis tool streamlines the design workflow and effectively bypasses the conventional "test-fail-fix-repeat" cycle by enabling designers to thoroughly simulate the interactions among silicon, metal layers, semiconductor packages, printed circuit boards (PCBs), and assemblies, thereby pinpointing potential failure vulnerabilities caused by thermal, mechanical, and manufacturing stresses before prototype development. With a comprehensive library exceeding 500,000 components, Sherlock adeptly converts electronic computer-aided design (ECAD) files into intricate computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each model generated is designed with accurate geometries and material properties, providing a detailed and thorough representation of stress data. This groundbreaking methodology not only improves the design process but also significantly shortens the time it takes for electronic products to reach the market, ultimately giving companies a competitive edge. Furthermore, the ability to preemptively identify and address issues during the design phase enhances the overall reliability and performance of the final products.

Media

Media

Integrations Supported

Additional information not provided

Integrations Supported

Additional information not provided

API Availability

Has API

API Availability

Has API

Pricing Information

Pricing not provided.
Free Trial Offered?
Free Version

Pricing Information

Pricing not provided.
Free Trial Offered?
Free Version

Supported Platforms

SaaS
Android
iPhone
iPad
Windows
Mac
On-Prem
Chromebook
Linux

Supported Platforms

SaaS
Android
iPhone
iPad
Windows
Mac
On-Prem
Chromebook
Linux

Customer Service / Support

Standard Support
24 Hour Support
Web-Based Support

Customer Service / Support

Standard Support
24 Hour Support
Web-Based Support

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Company Facts

Organization Name

ThermoAnalytics

Date Founded

1996

Company Location

United States

Company Website

www.thermoanalytics.com/taitherm

Company Facts

Organization Name

Ansys

Date Founded

1970

Company Location

United States

Company Website

www.ansys.com/products/structures/ansys-sherlock

Categories and Features

Categories and Features

CFD

Computer-Aided Engineering (CAE)

CAD/CAM Compatibility
Finite Element Analysis
Fluid Dynamics
Import / Export Files
Integrated 3D Modeling
Manufacturing Process Simulation
Mechanical Event Simulation
Multibody Dynamics
Thermal Analysis

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