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What is Siemens mPower?

The award-winning mPower solution delivers an all-encompassing analysis of power integrity for digital, analog, and 3D integrated circuits, accommodating a variety of design flows and scales. By effectively merging analog, semi-custom, and digital power integrity assessments into existing design processes, it adapts effortlessly to circuits and chips of any size. The mPower tool suite is crafted for rapid, scalable, and precise analysis, supporting everything from small blocks to large full-chip layouts, ensuring that power-related design goals and performance benchmarks are consistently met across all technology types and design variations. Additionally, the mPower analog power integrity analysis tool incorporates simulation-driven, high-capacity dynamic EM/IR analysis, which guarantees exceptional power integrity verification for analog designs through diverse design flows and scales. It also leverages industry-standard inputs and optimized memory specifications to improve scalability while minimizing the runtime of digital power integrity evaluations, establishing itself as an essential asset for engineers. This tool not only simplifies the design process but also significantly enhances the reliability of power analysis in intricate projects, thereby contributing to the overall success of design initiatives. Ultimately, mPower empowers engineers to achieve optimal performance and reliability in their designs, reinforcing its position as a critical component in modern engineering workflows.

What is 3DIC Compiler?

The Synopsys 3DIC Compiler, rooted in the premier digital implementation platform available in the market and utilizing a cohesive fusion data model, streamlines the transition to 2.5/3D heterogeneous integration. This all-encompassing ecosystem aids in conducting analysis-driven feasibility studies, enabling multi-die partitioning, and selecting suitable foundry technologies for both prototyping and floor planning purposes. Consequently, it empowers design implementation that is guided by meticulous analysis, encompassing sophisticated packaging and routing among dies, as well as thorough verification processes. Additionally, the 3DIC Compiler integrates with Synopsys 3DSO.ai, the pioneering autonomous AI optimization tool tailored for multi-die configurations, thereby optimizing performance and quality across critical domains such as thermal integrity, signal integrity, and power network design. The successful implementation of the 3DIC Compiler by a multitude of clients, coupled with certifications from leading foundries for its compatibility with cutting-edge process and packaging technologies, underscores its dependability and effectiveness across various applications. Ultimately, this emphasizes the platform's pivotal contribution to advancing semiconductor design methodologies and its role in shaping the future of the industry.

Media

Media

Integrations Supported

Additional information not provided

Integrations Supported

Additional information not provided

API Availability

API Availability

Pricing Information

Pricing not provided

Pricing Information

Pricing not provided
Free Trial Offered?

Supported Platforms

Windows
Linux

Supported Platforms

Windows

Customer Service / Support

Standard Support
Web-Based Support

Customer Service / Support

Standard Support
Web-Based Support

Training Options

Documentation Hub
Webinars
On-Site Training

Training Options

Documentation Hub
Webinars
Online Training
On-Site Training

Company Facts

Organization Name

Siemens

Date Founded

1847

Company Location

United States

Company Website

eda.sw.siemens.com/en-US/ic/mpower/

Company Facts

Organization Name

Synopsys

Date Founded

1986

Company Location

United States

Company Website

www.synopsys.com/implementation-and-signoff/3dic-design.html

Categories and Features

Categories and Features

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